Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

Samsung’s Power & Thermal Lab is seeking a thermal engineering intern to help build and calibrate models of HBM stacks and package.

We are a small, fast‑moving team where direct ownership and minimal busywork empower every member to tackle the same real‑world problems. Working with authentic data, real partners, and production‑grade results, our contributions flow straight into platforms used across the company.

As an intern, the models you build feed design discussions for future HBM products. You will work on real projects with tangible results, receive mentorship, and help shape the scope of work in a collaborative environment where hardware, software, and thermal experts work side‑by‑side on next‑generation AI memory technologies.