Sr. Staff Engineer, Signal-Integrity and Power-Integrity

• Master’s degree or higher in Electrical Engineering, or a related field. Candidates with relevant industry experience are preferred
• Experience: ≥ 5 years of experience in SIPI analysis in advanced semiconductor packaging.
• Technical Expertise: Proven knowledge of 2.5 D/3 D package architectures, HBM, interposer, TSV, high‑speed I/O standards, and power‑delivery networks.
• Simulation Tools: Proven proficiency with SIPI simulation tools (e.g., Synopsys 3DICC, Cadence Integrity 3D-IC/Sigrity, Ansys AEDT(Q3D, HFSS)/Siwave/RedHawk, HSPICE, Keysight ADS).
• Analytical Skills: Ability to interpret complex simulation data and translate it into actionable engineering recommendations.
• Communication: Excellent verbal and written communication skills; ability to present complex technical concepts to both engineering and executive audiences.

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• Hands-on experience with 2.5D/3D packaging for HBM, interposers, or GPU-memory integration.
• Expertise in power integrity (PI) for 3D-stacked memory systems, including PDN impedance profiling and IBIS model validation for HBM.
• In‑depth familiarity with industry standards such as PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
• Proficiency in scripting/automation (Python, TCL, SKILL) to create custom analysis flows and improve productivity.
• Experience validating high-speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
• History of published technical papers, patents, or conference presentations in advanced packaging or SIPI.

Benefits

• Top Tier health insurance at no employee cost
• Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
• 401k Matching
• Flexible Spending Account (FSA) for Health Care & Dependent Care
• Educational reimbursement up to $10,000 per year
• Donation Matching and volunteering opportunities
• Corporate discount programs
• Free Breakfast/Lunch/Dinner provided to employees

Compensation

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range

$165,000—$220,000 USD

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations.

We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model: Onsite

Job Summary

SK hynix America is seeking a skilled and motivated Signal‑Integrity and Power‑Integrity (SIPI) Engineer to join our Advanced Packaging (PKG) R&D team. In this role, you will be at the forefront of semiconductor innovation, driving the analysis, and validation of advanced System-in-Package (SiP) solutions for next-generation memory technologies, including High-Bandwidth Memory (HBM), interposer-based architectures, and GPU-integrated systems.

This role focuses exclusively on 2.5D/3D packaging innovations, driving electrical integrity and power delivery robustness for cutting-edge semiconductor platforms. The position requires deep technical understanding in high-speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced memory packaging.