- Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips.
- Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal.
- Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages.
- Cross-functional collaboration working alongside world-class architects, mechanical designers, package engineers, and software teams to understand how complex, large-scale chip ecosystems are built from scratch.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S.
As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.