- How to work at the cutting edge of high-speed interconnects, influencing the next generation of ASIC packaging and PCB architectures.
- Deep exposure to advanced ASIC packaging flows and collaboration models with internal and external packaging teams.
- Hands-on experience with emerging high-speed connector technologies and materials, including evaluating material trade-offs for performance and manufacturability.
- Best practices for end-to-end SI/PI validation, from simulation through to lab correlation, post-silicon bring-up, and field failure analysis.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S.
As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.