Staff EMIB-T Substrate Yield Engineer

Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Engineer to drive supplier yield, defect reduction, technical issue closure, and process-control maturity supporting next-generation EMIB-T substrates across Taiwan suppliers. The team will be chartered to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration partnering with substrate suppliers locally at the HVM factories.

This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG).