3DIC Platform Wet and Plating Development Manager
Intel, US, Oregon, Hillsboro
The role
Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. This role will drive the development and implementation of Wet Clean/Plating processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in Wet and Plating system optimization.
This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
What you will do
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment