Mechanical Engineer, Electronics Packaging & RF Components
Astranis, San Francisco, California
The role
As an Astranis Mechanical Engineer focused on Electronics Packaging and RF Components, you will design, analyze, build, and test enclosures for critical spacecraft electronics and RF components. You will contribute across the complete hardware lifecycle from requirements definition and concept development through detailed design, supplier coordination, assembly, and environmental testing.
Working at the intersection of mechanical, thermal, electrical, and RF engineering, you will solve challenging problems involving EMI/EMC isolation, high-power-density thermal management, and survivability in the launch environment. You will own the enclosure’s physical architecture, interfaces, manufacturability, and environmental robustness while partnering closely with RF and electrical engineers to verify electromagnetic and electrical performance.