High-Speed Digital Design Engineer
viaPhoton, Naperville, IL +1
The role
You'll advance the development of 200G+ systems and interfaces for our next-generation Co-Packaged Optics (CPO) products, owning the high-speed electrical data path from concept to production. This is deep, hands-on signal and power integrity work at the cutting edge of AI data center connectivity, and you'll guide and mentor junior engineers along the way.
- Advance the development of 200G+ systems and interfaces for our NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI)
- Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions
- Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance