Advanced Package Architect Sr. Staff Engineer

Marvell, Bangalore

What you need

8+ years of related professional experience.
Previous experience developing netlists and schematics for large, complex packages.
Previous experience developing C4 and BGA ball maps for high‑pin‑count designs.
Proficiency with design tools Cadence OrbitIO / Integrity System Planner (ISP) or equivalent
Strong foundational understanding of package design, including design rules, breakout, place and route, signal shielding, reference planes, power distribution, and pinout optimization across package and system requirements.
Solid grasp of SI/PI fundamentals at the substrate, board, and system levels; familiarity with running and interpreting signal and power simulations is a plus.
Knowledge of 2D, 2.5D, and emerging packaging architectures such as CoWoS‑S/R/L, EMIB, CPO, and CPC.
High‑level understanding of thermal and mechanical package constraints (e.g., warpage, TIM).

Marvell, Bangalore

8+ years of related professional experience.
Previous experience developing netlists and schematics for large, complex packages.
Previous experience developing C4 and BGA ball maps for high‑pin‑count designs.
Proficiency with design tools Cadence OrbitIO / Integrity System Planner (ISP) or equivalent
Strong foundational understanding of package design, including design rules, breakout, place and route, signal shielding, reference planes, power distribution, and pinout optimization across package and system requirements.
Solid grasp of SI/PI fundamentals at the substrate, board, and system levels; familiarity with running and interpreting signal and power simulations is a plus.
Knowledge of 2D, 2.5D, and emerging packaging architectures such as CoWoS‑S/R/L, EMIB, CPO, and CPC.
High‑level understanding of thermal and mechanical package constraints (e.g., warpage, TIM).