Advanced Packaging Senior Engineer
Marvell, Bucharest, Romania
What you need
- Bachelor’s degree in Electrical Engineering with 3 - 5 years of related professional experience or Master’s/PhD in Electrical Engineering with 1-3years of experience.
- Familiarity with IC package or PCB layout tools like Cadence APD, Xpedition Package Designer.
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
- Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC.
- Hands-on design experience on flip chip packages, 2.5D or 3D is a plus.
- Familiar with interpreting electrical simulation results such as IR Drop reports and S-parameter data, ability to run basic checks.