Advanced Package Technology, Principal Engineer
Marvell, Hsinchu City
What you need
What We're Looking For
- Experience in advanced package and substrate technologies with deep understanding of process and materials, component and board level reliability, warpage and thermal management. Experience in managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries.
- Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies. Experience in signal and power integrity simulations, analysis and optimization for 2.5D and 3D packages including interface with memory, interposer, substrates and PCBs. Ability to determine optimal signal routing, power delivery verification and package size determination