Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout. Package design experience using Siemens Xpedition EDA tool set is a must. Understand performance and cost trade-offs for different layout and assembly rules. Extensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required.
Practical knowledge of Signal integrity and Power integrity in PCB design will be an advantage. Possesses good analytical, communication and organization skills.
Job Type
Intel Contract Employee
Shift
Shift 1 (India)
Primary Location
India, Bangalore
Additional Locations
Posting Statement
Position of Trust N/A
Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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