Advanced Packaging TD Plating Module Engineer
Intel, US, Oregon, Hillsboro
The role
As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures. By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry.
Business group
You will be part of Intel's Advanced Packaging Technology Development organization, a pioneering team that focuses on creating robust and scalable manufacturing processes to support Intel's innovation in semiconductor technology. This group is instrumental in enabling high-volume production while driving advancements in device performance and reliability, helping Intel achieve its broader goals of technological excellence and industry leadership.