Mechanical Solutions Architect Intern

Astera Labs is a hyper-growth connectivity company building the purpose-built silicon and systems that power rack-scale AI infrastructure. As a Mechanical Solutions Architect Intern on our Solutions Architecture team, you will help ideate and build the mechanical systems around our products, from 3D CAD models to working prototypes that customers see and touch.

You will work alongside mechanical, hardware, silicon, and product teams on real deliverables: CAD assemblies, simulations, and demo systems that shape how hyperscalers, OEMs, and ODMs deploy Astera Labs solutions across PCIe, Ethernet, and UALink. Your work will help show how our connectivity accelerates AI and cloud data centers.

• Mechanical Design & Analysis
• Develop 3D CAD models of data center components and system-level assemblies
• Support the design of mechanical solutions such as sheet metal chassis, latches and engagement mechanisms, cable and fiber routing, and electrical connectors
• Run mechanical simulations and analyses (Ansys preferred) and summarize findings for the team
• Prototyping & Demonstrations
• Assist in building component and system prototypes and proofs of concept (POCs)
• Contribute to demonstrations for customers and industry events that highlight differentiated Astera Labs hardware solutions
• Cross-Functional Collaboration & Architecture
• Partner with product management, marketing, hardware engineering, and silicon engineering teams
• Provide system-driven inputs to inform product and technology roadmaps
• Translate technical results into clear, compelling summaries and presentations for internal and external audiences

• Currently pursuing a Bachelor's degree in Mechanical Engineering, Industrial Engineering, or a related technical field
• Foundational experience in 3D solid modeling (SolidWorks, PTC Creo, or similar) through coursework, projects, or prior internships
• Exposure to mechanical simulation tools (Ansys preferred)
• Basic understanding of mechanical design fundamentals, such as sheet metal, enclosures, or assemblies
• Strong written and verbal communication skills
• Ability to prioritize and manage tasks across multiple stakeholders in a fully in-person environment

• Coursework or hands-on project experience in data center, server, networking, or semiconductor hardware
• Familiarity with PCIe, Ethernet, and UALink interconnect standards, and with data center architectures (modules, servers, racks)
• Experience building prototypes through capstone, research, or student design team projects
• Interest in product or technical marketing, including white papers, technical blogs, or presentations

Internship experience and compensation

This is a paid, hourly U.S. internship. The applicable hourly rate is determined as part of the offer process and specified in the offer letter, depending on education level ranges from $35/hour to $55/hour. U.S. interns currently receive a $500-per-week housing/relocation stipend for the duration of the internship. Interns participate in Early Career programming, including technical and professional-development sessions, community events, and an end-of-program project presentation.