Platform Solutions Product Management Intern

Location: Cary, North Carolina Employment type: Paid, hourly internship

As a Platform Solutions Product Management Intern, you will help shape platform solutions that combine Astera Labs connectivity products with complete AI and cloud infrastructure systems. You will work with product managers, hardware and firmware engineers, applications teams, marketing, and ecosystem partners to understand requirements, organize priorities, and turn technical findings into clear product and platform decisions.

This internship is an opportunity to build technical product-management experience across high-speed connectivity, reference architectures, system validation, partner ecosystems, and software-enabled platform solutions.

• Research platform, customer, partner, and ecosystem needs across AI servers, rack-scale systems, and networking infrastructure.
• Help translate technical and market inputs into product requirements, user stories, use cases, and prioritized backlogs.
• Support product roadmap planning by organizing requirements, dependencies, milestones, risks, and open questions.
• Work with engineering and applications teams to understand PCIe®, CXL®, Ethernet, NVLink, UALink™, switch, retimer, and platform capabilities.
• Support reference-design and proof-of-concept planning, including success criteria, demonstrations, and transition considerations.
• Analyze platform-validation results, customer feedback, and competitive or ecosystem information to identify product opportunities and gaps.
• Prepare concise technical briefs, presentations, requirements documents, status updates, and decision materials for cross-functional stakeholders.
• Help maintain product-management workflows, including Jira work items, requirements trackers, meeting notes, and action-item follow-up.
• Collaborate with hardware, firmware, product applications, field applications, marketing, and external ecosystem teams to keep platform efforts aligned.

What you bring

• Currently pursuing a bachelor’s or master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Foundational understanding of computer systems, digital hardware, software, networking, or high-speed connectivity.
• Strong analytical, organizational, and written and verbal communication skills.
• Ability to understand technical information, ask effective questions, and summarize complex topics clearly.
• Experience through coursework, projects, research, student organizations, or internships with technical problem-solving or project coordination.
• Familiarity with spreadsheets, presentations, documentation tools, or project-tracking systems.
• A hands-on work ethic, curiosity, and ability to prioritize multiple tasks in a fast-moving environment.

• Familiarity with PCIe®, CXL®, Ethernet, NVLink, UALink™, AI infrastructure, server platforms, or networking systems.
• Experience gathering requirements, writing user stories, creating product or project plans, or maintaining a backlog.
• Exposure to reference designs, system validation, proof-of-concept development, or customer and ecosystem-partner collaboration.
• Experience with Jira, Confluence, data analysis, competitive research, or technical market research.
• Interest in product lifecycle management from requirements and design through validation, deployment, and production.
• Ability to communicate effectively with both technical and non-technical audiences.

Internship experience and compensation

This is a paid, hourly U.S. internship. The applicable hourly rate is determined as part of the offer process and specified in the offer letter, depending on education level ranges form $35/hour to $55/hour. U.S. interns currently receive a $500-per-week housing/relocation stipend for the duration of the internship. Interns participate in Early Career programming, including technical and professional-development sessions, community events, and an end-of-program project presentation.

Astera Labs develops purpose-built connectivity solutions for rack-scale AI infrastructure. Our Intelligent Connectivity Platform brings together PCIe®, CXL®, Ethernet, NVLink, and UALink™ technologies to help customers build high-performance, flexible systems.