3DIC Device Development Engineer
Intel, US, Oregon, Hillsboro +2
The team
Manufacturing Development and Customer Engineering (MDCE) serves as the critical bridge between Technology Development (TD) and High Volume Manufacturing (HVM) within Intel Foundry. The organization is responsible for transitioning leading-edge technologies from development and qualification into high-yield production while enabling successful deployment for foundry customers.
The MDCE Device Team is expanding its 3DIC device engineering capabilities and is seeking an experienced engineer to drive device understanding and optimization for advanced 3D integration technologies.
Position Overview
As a 3DIC Device Development Engineer, you will be responsible for understanding, characterizing, and modeling the impact of advanced 3D integration technologies on transistor and passive device performance. Technologies such as through-silicon vias (TSVs), hybrid bonding, active base die architectures, wafer thinning, and backside power delivery introduce new mechanical, thermal, and electrical interactions that influence device behavior, variability, and reliability.