Staff AI Systems Thermal Engineer

We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.

In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems—ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.