- How to shape thermal architecture for next-generation AI platforms, from high-power PCIe cards and multi-chip servers to rack-scale systems.
- How to bring advanced liquid cooling together with air and hybrid cooling technologies in products designed for performance, reliability, and scalable manufacturing.
- How thermal simulations, lab validation, supplier development, and product integration work together to take complex cooling solutions from architecture through production.
- How to influence future AI cooling strategies and technical standards while working across thermal, mechanical, electrical, manufacturing, and supplier teams.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S.
As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.