Computational Electromagnetics Engineer – Signal Integrity

Vinci, Palo Alto HQ

The role

We are looking for a computational electromagnetics engineer with deep expertise in signal integrity simulation for the semiconductor and electronics industry. You understand Maxwell's equations well enough to derive discretisations from scratch, and you have shipped production EM solvers or SI analysis tools that real engineers have relied on to qualify packages, characterise high-speed channels, or sign off interfaces at multi-gigabit data rates.

You will design and implement EM solver capabilities within Vinci4D's multi-physics platform — spanning signal integrity analysis, frequency-domain and time-domain full-wave methods, and quasi-static extraction. You will bring the domain depth needed to make those tools genuinely useful for signal integrity, power integrity, and EM-thermal coupling workflows in semiconductor packaging and PCB design.

All jobs

Computational Electromagnetics Engineer – Signal Integrity

Vinci, Palo Alto HQ

Posted pay

$180K–$210K

a year

Compared with similar jobs

This base pay is above the median for hardware and robotics jobs in the Bay Area with no level in the job title.

Median: $175K a year
Other jobs in the group: 564

We compare the middle of each posted range. This is base pay as posted. The group does not include this job.

Location: Palo Alto HQ
Work type: Hybrid
Level: Not given
Experience: 4+ years
Skills in the job text: Python
C++
CUDA
PCB design
Posted: Aug 17, 2026
Last check: 9 h ago
Job type: Hardware and robotics

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Vinci

Open tech jobs: 27
With posted pay: 93%
Median posted base: $175K–$215K

About Vinci: funding, hiring and pay

Vinci

About Vinci: funding, hiring and pay

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The role

What you need

Technical skills — must have

Deep working knowledge of computational electromagnetics: FDTD, FDFD, and quasi-static methods, with a clear understanding of when each is appropriate and what their failure modes are
Hands-on experience with signal integrity simulation for the semiconductor industry — high-speed channel analysis, package and via characterisation, transmission line extraction, crosstalk, or PDN impedance — with an understanding of the numerics behind the tools, not just their outputs
Solid understanding of the full SI simulation workflow: from 3D EM field solutions through S-parameter extraction, through channel simulation, to eye diagram and margin analysis
Experience implementing FDTD solvers including the Yee cell staggered update, CFL stability, PML or absorbing boundary conditions, and port-based S-parameter extraction via Fourier analysis of time-domain responses
Experience with frequency-domain EM (FDFD or equivalent) including complex material properties, frequency sweeps, and direct or iterative solution of the resulting sparse complex linear systems
Experience with quasi-static field solvers for resistive, capacitive, and inductive parasitic extraction, including frequency-dependent skin-effect modelling
Proficiency in C++ and/or Python in a performance-critical scientific computing context
Strong software engineering practices: Git, code review, automated testing, CI/CD pipelines, and regression testing against reference solutions

Technical skills — desired

Working knowledge of high-speed interface standards relevant to semiconductor packaging: PCIe, DDR5/6, HBM, LPDDR, or equivalent SerDes interfaces at data rates above 10 Gbps
Experience with S-parameter characterisation and touchstone file workflows — generating, validating, and consuming multi-port S-parameter models in a production SI context
Solid understanding of the scale hierarchy in SI simulation: what quasi-static extraction covers, where full-wave treatment is required, and how the two are combined in a complete channel model
Familiarity with the EM-thermal coupling path in high-speed packaging or power electronics: deriving Ohmic heating from EM field solutions and using it as a thermal source term

Experience

4–8 years of industry or research experience in computational electromagnetics applied to semiconductor packaging, PCB design, or high-speed electronics
Experience working within or closely alongside EDA-adjacent workflows — understanding how EM simulation outputs connect to circuit simulators, layout tools, and SI sign-off flows
A track record of delivering validated, production-quality solver code or extraction tools — not just academic prototypes

Soft skills

Able to communicate EM concepts clearly to a multi-disciplinary team that includes thermal engineers, CFD specialists, and software engineers without a CEM background
Collaborative and generous with knowledge: you document your formulations, write readable code, and help teammates understand the physics
Comfortable with ambiguity: requirements evolve, benchmarks are sometimes wrong, and the right numerical formulation is not always obvious upfront
Self-directed and ownership-oriented: you drive your work from mathematical formulation through implementation through validation to integration

Computational Electromagnetics Engineer – Signal Integrity

The role

Computational Electromagnetics Engineer – Signal Integrity

The role

What you will do

What you need

Technical skills — must have

Technical skills — desired

Experience

Soft skills

Nice to have

Why Vinci4D

About Vinci

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