Principal Thermal-Mechanical Engineer-Munich, Germany

• Education: Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
• Technical depth: Expert-level mastery of commercial FEA software (e.g., Ansys Mechanical, Abaqus, or equivalent), with 15+ years of hands-on experience in thermo-mechanical simulations— either as a practitioner running simulations or as a technical account manager for commercial physics simulation software.
• Industry Domain: Deep familiarity with semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.
• Customer Engagement: Prior experience in dedicated customer-facing roles, with a strong ability to build trust and manage engineering client relationships.
• Automation & Scripting: Practical programming experience using Python or C++ to automate workflows or parse simulation data.
• Leadership Impact: Proven track record of prior managerial or technical leadership experience, with the ability to scale, mentor, and drive execution across engineering teams.
• Communication: Elite interpersonal and communication skills, with a proven ability to distill complex physics and simulation results into clear, high-impact narratives for both deep technical panels and business-oriented executives.

• Multiphysics Breadth: Familiarity with thermal management and cooling solutions and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
• Commercial Track Record: Direct experience commercializing technical software—ideally electronic design automation (EDA) or CAE simulation tools—into major semiconductor and electronics enterprises.
• Go-To-Market Experience: Prior experience explicitly within technical pre-sales, application engineering (FAE), or strategic technical sales environments.
• Emerging Tech Adjacency: Ability to rapidly adopt and champion next-generation, physics-based workflows and AI-assisted design or simulation tools.

About Us

We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.

Our first product bridges the gap between the accuracy & determinism of traditional simulation and the speed & scaling of AI, and is redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.

Role Overview

As a pivotal leader within our European Forward Deployment team, you will drive the adoption of Vinci’s platform among the region's top engineering organizations. In this strategic role, you will build, mentor, and guide a high-performing team of thermal engineers dedicated to engaging prospective customers and demonstrating our software's transformative value.

As trusted technical advisors, you and your team will use deep simulation expertise to help enterprise customers validate and optimize complex, real-world designs. Through these collaborative engagements, you will champion Vinci's value proposition by showing how our platform delivers systemic improvements in thermal performance, product reliability, and time-to-market.

Leveraging strong fundamentals in continuum mechanics, you will guide analyses of complex physical phenomena, including linear, geometric and material nonlinearities, and contact interactions. Your team will evaluate critical factors such as warpage, stress evolution, thermal cycling, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems.

You will work closely with customer engineering teams to understand their technical challenges, provide expert guidance, and clearly articulate Vinci’s capabilities in solving real-world problems. You will also serve as a key feedback channel to product and engineering teams, translating customer insights into actionable inputs that shape product direction and drive continuous improvement.

This is a remote role, with close collaboration with Sales, Product, and Engineering in Palo Alto, CA, USA. The role includes moderate travel, primarily within continental Europe. Some infrequent intercontinental travel may be required for discussions and collaboration with the US team.

Why Join Us

• Not just use AI; be part of a team actively redefining how next-generation silicon and hardware are architected.
• Work at the absolute convergence of state-of-the-art AI models, fundamental physics, and high-stakes enterprise engineering.
• Collaborate with world-class engineers and researchers in a fast-moving startup environment.