Cloud HDE II - AMZ009076

Job Location: 11815 Alterra Pkwy, Austin, TX 78758

Job Number: AMZ009076

Position Responsibilities: Collaborate across diverse teams, projects, and environments to have a firsthand impact on our global customer base. Work with advanced packaging technologies, PCBdesign, and power delivery systems. Work in a dynamic environment, influencing product decisions while solving cutting-edge challenges in high-speed digital design. Perform electrical design, modeling and characterization of advanced microelectronic packages including all signal and power integrity aspects while considering manufacturing and assembly tolerances.

Play a key role in the definition, design and validation of AWS next generation machine learning ASICs. Participate in the design and execution of all SI related topics, with the goal of creating and customized platforms that fit within AWS datacenter’s world leading technology. Utilize experience in signal and power integrity, with hands-on expertise in simulation tools like Hspice, Cadence, and HFSS. Work on advanced packaging technologies, PCB design, and power delivery systems.

Have a direct impact on product quality through innovative solutions for complex signal integrity challenges, requiring both technical depth and cross-functional collaboration skills. Influence product decisions while solving cutting-edge challenges in high-speed digital design. Develop solutions to help our team drive efficiencies in hardware architecture, improve simulation and measurements methodologies and flows.

Position Requirements: Master’s degree or foreign equivalent in Electronics Engineering, Mechanical Engineering or related field and one (1) year of experience in the job offered or related occupation. Education and Experience: Employer will accept a Bachelor’s degree or foreign equivalent in Electronics Engineering, Mechanical Engineering or related field and five (5) years of experience as equivalent to the Master’s degree and one (1) year of experience.

Must have one (1) year of experience with: (1) layout and 3D Field solver simulations tools for Signal and Power Integrity; (2) high frequency VNA measurements up to 50GHz; and (3) constraint management, PCB manufacturing tolerances and procedures, including layout routing.

40 hours / week, 8:00am – 5:00pm, Salary Range $178,464 - $184,000 / year

Please see job description and requirements above.

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Read the job posting on the Annapurna Labs (U.S.) Inc. site

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