Annapurna Labs, our organization within Amazon Web Services (AWS), designs custom silicon and software that accelerates cloud innovation. Within Annapurna, the Packaging team focuses on the thermal, mechanical, and materials engineering challenges that come with pushing semiconductor package performance forward. We work closely with Quality and Reliability, Package Design, Test, and System Design groups to deliver robust, manufacturable solutions at data-center scale.
Our team values collaboration and knowledge sharing. We are investing in advanced packaging technologies to support the growing demands of machine learning and compute workloads, and you will play a direct role in shaping those next-generation solutions.
- Bachelor's degree in mechanical engineering or equivalent
- 5+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design
- 3+ years industry experience in advanced packaging of semiconductors
- Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials
- Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals
- Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software
- Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
- Strong understanding of product development lifecycles from concept through high volume manufacturing
- Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs.
- Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
- Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies.
- Knowledge of hardware and software based thermal / power management control algorithms
- Validated thermal models through power/thermal measurements on Hardware
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The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave.
Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, TX, Austin – 153,600.00 - 215,000.00 USD annually