In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have developed products that power every layer of the AWS cloud, including AWS Nitro, Graviton processors, and custom ML/AI accelerators — Trainium for training and Inferentia for inference — that enable customers to build and run generative AI applications at scale.
The ML/AI MTE team is part of the Annapurna ML/AI hardware development organization. We design and deliver the thermal and mechanical systems for every generation of custom ML/AI accelerator hardware — from chip package through rack-level infrastructure. Our platforms operate at massive scale across AWS data centers globally, with current programs including next-generation Trainium and Inferentia systems featuring liquid cooling at scale.
- BS degree in mechanical engineering or equivalent
- 7+ years industry experience in Mechanical and Thermal design in electronics packaging
- Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems
- 3+ years of experience in SoC Thermal modelling and IC package transient thermal response
- Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems
- Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging
- Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies
- Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams
- Knowledge of generic mechanical room infrastructure such as chillers, cooler units, and fan controls
- Experience in mentoring, leading, or managing more junior engineers
- Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
- Tool familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
- Proficiency in 3D CAD modeling and engineering drawings per ASME Y14.5 (GD&T) standards
- Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in a Linux environment
- Knowledge of various types of technologies used for heatsink solutions, Thermal Interface Materials (TIMs), and liquid cooling technologies
- Knowledge of hardware and software based thermal/power management control algorithms
- Experience with liquid cooling system design: rack manifolds, cold plates, quick-disconnect fittings, CDU integration
- Experience with mechanical design of high-density interconnect systems (cable cartridges, blind-mate connectors, backplane assemblies)
- Experience with high-power-density ML/AI accelerator or HPC thermal design
- Track record of driving cost optimization through vendor strategy, second-sourcing, or design-for-manufacturing improvements
- Familiarity with manufacturing processes: injection molding, sheet metal fabrication, die-casting, and CNC machining — including trade-offs between methods
- Experience with shock, vibration, and structural qualification testing per ISTA, ASTM, or equivalent standards
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position.
These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
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The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave.
Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, Cupertino – 183,000.00 - 247,600.00 USD annually
USA, TX, Austin – 159,200.00 - 215,300.00 USD annually
USA, WA, Seattle – 159,200.00 - 215,300.00 USD annually