Advanced Packaging SI/PI Engineer
Etched, San Jose
What you will do
- SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
- Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance
- Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out.
- Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across all rails.
- Own ball map / C4 / BGA pin assignment from soft freeze through final freeze in partnership with package layout, ASIC PD, and board layout teams.
- Support board-level SI/PI and rack-level scale-up topology studies, including rack test vehicle design and cable characterization.