Principal Package Engineer

What you will do

Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
Perform high-speed signal escaping, routing and power distribution network design.
Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
Evaluate emerging packaging technologies and drive adoption for next‑generation products.
Support package‑level bring‑up, failure analysis, debug and qualification.

$180K–$270K

a year

This base pay is below the median for principal software engineering jobs in the Bay Area.

We compare the middle of each posted range. This is base pay as posted. The group does not include this job.

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Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
Perform high-speed signal escaping, routing and power distribution network design.
Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
Evaluate emerging packaging technologies and drive adoption for next‑generation products.
Support package‑level bring‑up, failure analysis, debug and qualification.