Principal Advanced Packaging Design Engineer

What We're Looking For

• Extensive experience in substrate and/or board design for advanced packaging technologies.
• Solid understanding of design-for-manufacturing (DFM) and reliability principles, as well as electrical performance considerations, with the ability to make appropriate trade-off decisions.
• Proven ability to lead complex package architecture development projects involving relevant internal stakeholders, external partners, and customers.
• Expertise in industry-standard tools and workflows, including Cadence 3DIC, ISP, APD, and SiP.
• Bachelor's degree in Electrical Engineering or a related field with 15+ years of relevant professional experience; Master's degree with 12+ years of relevant professional experience; or Ph.D. with 8+ years of relevant professional experience.

Skills Needed to Be Successful in This Role