HBM SoC Physical Design Engineer

As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations.

• Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets.
• Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
• Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity.