Advanced Packaging Module Development Engineer

Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. Our Oregon campus in Hillsboro is one of Intel's largest and most strategically important sites globally, serving as a hub for cutting-edge semiconductor research, development, and high-volume manufacturing.

At Intel, we believe in the power of human ingenuity and are committed to creating an inclusive, collaborative environment where brilliant minds come together to solve the world's most complex technological challenges.