- The opportunity to design power distribution systems for next-generation AI accelerator cards and high-performance computing platforms.
- Practical experience balancing power integrity, voltage regulation, thermal performance, board area, cost, and reliability in complex PCB designs.
- Deeper expertise in power architectures, VR tuning, PDN optimization, and the application of industry standards across consumer and datacenter systems.
- Exposure to the complete hardware development lifecycle, including simulation, schematic and layout guidance, prototyping, board bring-up, validation, and post-silicon debugging.
- How power design decisions integrate with broader system architecture through close collaboration with hardware, firmware/software, thermal, mechanical, and validation teams.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S.
As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.