HBM SIPI, Senior Engineer

• Signal integrity channel analysis for 2.5D and 3D silicon interposer — including frequency-domain characterization (insertion loss, return loss, PSXT, IL-to-XT ratio) and time-domain analysis (eye diagram, BER, jitter decomposition)
• Conduct mask‑based timing analysis using time‑domain simulations (e.g., SPICE, ADS).
• Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
• Electromagnetic extraction and modeling of signal and power delivery channels (PCB, Package, Interposers, etc.).
• Automate sign-off processes and work with EDA suppliers to improve tool accuracy and analysis flow.

• 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
• Deep understanding of SI/PI, electromagnetic and transmission line theory, I/O design.
• Experience in circuit simulation such as Keysight ADS and Synopsys HSPICE.
• Use AI/ML/LLM for productivity or efficiency

• 7+ years of experience in signal integrity and power delivery network (PDN) modeling and analysis.
• Experience in SI/PI modeling and analysis for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer-based designs), including time-domain analysis (eye diagram, BER, jitter decomposition, PDN) and frequency-domain characterization (S-parameters, PDN impedance)
• Experience with mask-based timing budget and jitter analysis with time-domain simulation (SPICE, ADS, etc)
• Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency in simulation and analysis using industry-standard EDA tools, including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, Cadence PowerSI/PowerDC.

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Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications.

Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads.