Silicon Package Design Engineer
Intel, India, Bangalore
The role
Join Intel as a Silicon Packaging Design Engineer, where you will be at the forefront of semiconductor innovation, driving the end-to-end development of cutting-edge substrate designs. In this role, you will perform substrate fit and routing studies to optimize performance, cost, and manufacturability while collaborating with customers and internal teams. Your contributions will directly impact the creation of Intel's advanced silicon packaging solutions, ensuring they meet electrical and manufacturing requirements.
What you will do
- Develop physical layout designs for silicon packages, assembly test chips, and Intel's EMIB (Embedded Multi-die Interconnect Bridge) technologies.
