- 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.
- MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience.
- Hands-on invention and deployment of advanced solutions e.g., EMIB, UCIe, CPO, high density connectors.
- Deep experience with electrical, computer, and packaging engineering and deployment of such in products
- Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing
Ways to stand out from the crowd
- An industry veteran with proven track record of bringing advanced SI concepts from research to product
- A known pioneer in any industry standard high speed signaling technology
- Deep knowledge of operation and manufacturing challenges of package substrate, PCB, cables and connectors
Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until November 10, 2026.
This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.